Intel Presentation Template Overview

Intel Presentation Template Overview

Shenzhen 2015 Designing Great 2 in 1 Devices Wang Kai P, Intel Wang Kai K, Intel Legal Disclaimer Information in this document is provided in connection with intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in intel's terms and conditions of sale for such products, intel assumes no liability whatsoever, and intel disclaims any express or implied warranty relating to sale and/or use of intel products, including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. A "mission critical application" is any application in which failure of the Intel product could result, directly or indirectly, in personal injury or death. Should you purchase or use Intel's products for any such mission critical application, you shall indemnify and hold Intel and its subsidiaries, subcontractors and affiliates, and the directors, officers, and employees of each, harmless against all claims costs, damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of product liability, personal injury, or death arising in any way out of such mission critical application, whether or not Intel or its subcontractor was negligent in the design, manufacture, or warning of the Intel product or any of its parts. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined". Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information. The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or go to: http://www.Intel.Com/design/literature.Htm. All information provided related to future Intel products and plans is preliminary and subject to change at any time, without notice. Intel and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. * Other names and brands may be claimed as the property of others. All materials in, and discussions of, this presentation are classified as Intel confidential and are subject to the non-disclosure agreement between Microsoft Corporation and Intel Corporation dated October 24, 1990. 2 Copyright 2014, Intel Corporation. All rights reserved. 3 Agenda Review of Hardware Recommendation

for Microsofts Continuum Support Introduction on Dynamic Platform Thermal Framework Key strategies to reduce system thickness on your fanless designs and tradeoffs on system design to go thin Focus on Intel Core M Processor Device Landscape Focus on Intel Core M today Phone/ Tablet <7 Phone & > 7 Tablet Thinnest, Lightest, Longest Battery Life Small Screen 2 in 1 Fanless Detachable Small Screen 2 in 1 Convertible Large Screen 2 in 1 10.1 12.5 11.6 12.5 13.3 15.6 2 in 1 in Ultra-Thin

Detachable Fanless Designs 2 in 1 in Ultra-Portable Convertible form factor 2 in 1: Full PC performance and Tablet convenience in one versatile device Tablet Experience Ultra-Thin Notebook1 Mainstream Notebook 11.6 14 11.6 17.3 A Lightweight Notebook with compelling Performance & Great Battery Life A classic Productivity Notebook with balance of Great Performance and Portability 2 in 1 Experience High

Performance Notebook 14-18.4 Feature Rich & Highest Performance Notebook PC Experience Broadwell H Intel Core M Processor Intel Core Processor (Broadwell-U) Intel Core M Processor (For (For Fanless Fanless Designs) Designs) Intel Atom Processor (Baytrail-T) (For (For Fanless Fanless Designs) Designs) Intel Pentium Processor (Baytrail-M) BYT-M

SOFIA Family 1 Ultrabook offered for corporate notebooks Focus on Intel Core M Processor Intel Confidential 24 *Other names and brands may be claimed as the property of others Agenda Review of Hardware Recommendation for Microsofts Continuum Support Introduction on Dynamic Platform Thermal Framework Key strategies to reduce system thickness on your fanless designs and tradeoffs on system design to go thin Windows* 10 Continuum improves UX for 2 in 1s Microsoft started to support 2 in 1 mode aware from Windows 8.0 OS, and Intel began platform enabling on this feature from Haswell platform generation too. Windows* 10 Continuum offers a new, adaptive, user experience through optimizing the look and behavior of apps and the Windows. OEMs/ODMs can report hardware transition to enable more automatics and contextual entry into and exit from "tablet mode". Intel is heavily promoting and enabling this platform capability to all OEM/ODM partners.

Do you want to enter Tablet mode? Note: the above screen shot was captured on Windows* 10 Technical Preview 9926 release. The prompt message of Continuum feature might change in the future Windows* 10 release. 7 Intels solution to deliver mode change to the OS When user changes the mode from clamshell to tablet and vice versa, Sensor hub FW/EC/BIOS should notify appropriate indicator Clamshell/Slate mode PNP0C60. Sensor hub FW & EC To implement this feature, OEMs/ODMs need to have: Sensor FW & EC support Have key logic designed to determine and notify right device mode to BIOS. BIOS support - BIOS uses ACPI control method to send notifications to Intels Virtual Buttons Driver. Please refer to details from Virtual Buttons and Indicators BIOS Requirements chapter of Intels BIOS Enabling Guide for Windows* 10 doc (IBP# 557130). +

Intel Virtual Buttons Driver installed - Kit#: 104175 Intel(R) Virtual Buttons driver HF2 1.0.0.17 The kit may be changed to incorporate Windows* 10 support in the future SBIOS Intel Virtual Buttons Driver Inbox GPIO Button Driver OEM/ODM Intel OS MSFT Intels tool to test 2 in 1 mode change feature Intel has designed a simple tool 2in1 Mode Detection Test Tool version 5.1.0.1829 (Kit#:1003098+, under test tool category) to test the implementation of 2 in 1 mode change. OEM/ODM partners are encouraged to run this test once you have full chassis system and sensor/EC/BIOS implementation in place. The tool quick start guide is included in the kit, and please read it before conducting your testing. The tools snapshots below: The first step: choose device form factor + The kit may be changed to incorporate Windows* 10 support in the future

The last step: you can go through Result column (yellow box) to get the results, and also save the results (red oval) and send it to Intels support team in case of any failure. Agenda Review of Hardware Recommendation for Microsofts Continuum Support Introduction on Dynamic Platform Thermal Framework Key strategies to reduce system thickness on your fanless designs and tradeoffs on system design to go thin Intel DPTF Dynamic Platform Thermal Framework Intel DPTF is the Key Driver of Power/Thermal Management 11 Intel DPTF Passive Policy I Introduction Power (W) Dynamic Dynamic PL1 PL1 starts starts to to adaptively adaptively control control DPTF_PSV DPTF_PSV within within skin skin thermal thermal spec. spec. The

The Control Control algorithm algorithm could could go go as as low low as as cTDP-Base/cTDP-Down cTDP-Base/cTDP-Down to to maintain maintain skin skin based based on on system system thermal thermal requirements. requirements. Pkg Power SOC Tjmax Thermal design target Skin thermal design target PL1 >=TDP Pkg Power (DPTF) PL1 @

cTDP-Base/ cTDP-Down Board Sensor*_ Temp Temperature (C) Tjmax DPTF_PSV corresponding to Skin spec Skin spec Skin Temp (DPTF) Skin Temp Time (sec) Note: An accurate on-board thermal sensor to monitor skin thermal requirement to provide the best performance in thermally constrained platforms 12 Switchable Dynamic PL1 Scenario Design Optimized dynamic PL1 algorithm to different scenarios to maximize system performance and enhance UX. Horizontal Tablet: 3 .5W Vertical Tablet / Clamshell 4-6W

Active Dock 6-8W Brings the benefits of core performance scaling for 2:1s Intel DPTF provides instant and dynamic contextual performance management to enhance 2-in-1 user experience. The The higher higher PL1 PL1 is is possible possible to to have have better better performance. performance. The The number number is is an an example, example, not not the the real real result. result. 13 Agenda Review of Hardware Recommendation for Microsofts Continuum Support

Introduction on Dynamic Platform Thermal Framework Key strategies to reduce system thickness on your fanless designs and tradeoffs on system design to go thin A New Approach to Design Innovation XY Z De sig Ru les n Innovate solutions What Contributes to Thin & Fanless Designs Display Panel Selection Choosing thinner panels Power consumption Using 2 x64 LPDDR3 PMIC VR solution

Chassis Advancements Thermals Component Area Improved methods to disperse heat Manage air gaps Thin die-cast Aluminum A panel System Stack-up Balance heat dissipation through back panel & display PCB Minimize size and/or Z-height for proper battery capacity or system thickness Type 4 uVia technology These are areas that you influence in your platform

Designing Thin and Small Motherboards 30 mm Wi-Fi SSD Mainboard: 10 layer Type 4 PCB 2-6-2+ Layout, single sided component placement 2 x64 LPDDR3 memory solution Daughter card: 6 layer Type 3 PCB SoC Power 100 mm Memory EC PMIC power delivery CPU facing rear, Storage and Wi-fi facing screen Power 64 mm Mix of mainboard or main/daughter card; configurable design with M.2 connectors

Rear Panel Die Cast Aluminum Aluminum die cast can produce thin & light chassis components IDV 12.5 chassis only 0.75 mm thick & 124 gm Used hard tooling A-cover Outer Side Al die cast thickness as thin as: 0.4 mm for 10 and below systems 0.55 mm for 11.6 systems; 0.75mm for 12.5 & larger A-cover Inner Side Thin Al Die Cast is a viable option for thin & light tablets Memory Layout Optimization 64 x 100 mm 4.3 mm SoC * 43W x a m 3 3mil 5 s 7

3 1. DRAM 40 x 100 mm 2.5 mm Two x64 LPDDR3 devices Crosstalk mitigated by shorter routes No RTT resistors (and VTT traces) 3-on-3 instead of 3-on-7 X64 LPDDR3 same side as processor Requires Type 4, 10 Layer PCB. Possible with 2-6-2+ stack-up *Routing example applies to Data signals, intra-group spacing. Refer to Platform Design Guide for complete solution details. x64 LPDDR3 on bottom side Requires Type 4, 10L Any Layer PCB TWO x64 LPDDR3 placed very close to processor package can achieve board size savings System Layout HVM-friendly layout for 12.5 Thin & Fanless Design For complete details, refer to Go Thin & Fanless Design Kit (IBP Doc # 549355) Wi-Fi*/

SSDBluetooth 34 Whr Battery 2 cells (17 Whr ea) Single Motherboard CPU 2 x64 LPDDR3 Single Package 130 x 135 x 3 mm PMIC Power LTE M.2 NGFF System Stack-up Cross Section at Processor 2.8 Glass + TP + Panel Heat Spreader 0.45 Air Gap 0.74

MB CPU CPU Shielding + TIM 1.45 Air Gap 0.2 0.75 Heat Spreader Rear Cover Total: 7.99 mm Glass + TP + Panel 2.8 Heat Spreader Air Gap M.2 0.15 0.95 0.5 Cross Section at LTE Module MB

LTE Air Gap 0.15 0.45 0.74 2.4 0.5 Heat Spreader Rear Cover 0.2 0.75 Total: 7.99 mm Thermal Consideration Thermal Ergonomic Specifications MOS 5.0 4.5 4.0 PCCG Ergonomic Specifications Tablet (C) User Perception Metal Plastic Glass Not perceptible Barely perceptible, not annoying

3.5 For Hand-held 3.0 2.5 2.0 1.5 1.0 Perceptible and slightly annoying For On-Table Perceptible and very annoying Perceptible and extremely annoying 30 34 38 30 37 44 30 34 40 41 50

43 44 55 46 46 60 48 49 52 64 67 52 56 55 71 66 Recommend MOS 3.5 for Hand-held and MOS 2.5 for On-table MOS Cover 3.5 41

2.5 46 Thermal Consideration Thermal Simulation Condition Running Skype* 720P via LTE Hand-Held/On-Table Ta=25c Calculating Modeling Result LCD 43 48 MOS Cover 3.5 41 2.5 46 Thermal Consideration Thermal Simulation Results (Skype* 720P via LTE ) Temperature 6 0 On-Table

Hand-Held LCD LCD 43 48 LCD 5 3 42.8 Rear CoverC 46.7C Rear Cover 4 6 3 9 3 2 38.7C 45.3C LCD & Rear Cover can meet MOS 3.5 as Hand-Held mode/MOS 2.5 On-Table mode 2 5

Thermal Consideration Thermal ideas for thin form factors Cooler skin Air Gap Enough air gap Select Low-power panel Graphite and Cu spreaders on display / rear cover Larger heat spreaders for main hot component Dont stack CPU underneath the display backlight Make batteries split. (Optimum) Increased Cu content in the motherboard Hotter skin Spreader

Spreader CP MB U Air is the best low-cost thermal insulator CP MB U Thermal Consideration Thermal ideas for thin form factors Enough air gap Select Low-power panel Graphite and Cu spreaders on display / rear cover Larger heat spreaders for main hot component Dont stack CPU underneath the display backlight

Make batteries split. (Optimum) Increased Cu content in the motherboard It can lower whole LCD temperature Hi-power LCD 46.7C Low-power LCD 43.3C Thermal Consideration Thermal ideas for thin form factors Enough air gap Select Low-power panel Graphite and Cu spreaders on display / rear cover Larger heat spreaders for main hot component

Dont stack CPU underneath the display backlight Make batteries split. (Optimum) Increased Cu content in the motherboard Hot spot 46.7C Graphite 44.6C It can transfer heat to cooler area and make skin cooler Thermal Consideration Thermal ideas for thin form factors Enough air gap Select Low-power panel Graphite and Cu spreaders on display / rear cover

Hotter skin Cooler skin Spreader Spreader CP MB U CP MB U Larger heat spreaders for main hot component Dont stack CPU underneath the display backlight Make batteries split. (Optimum) Increased Cu content in the motherboard It can spread more heat from CPU and make skin cooler Heat Spreader On CPU

Thermal Consideration Thermal ideas for thin form factors Enough air gap Select Low-power panel Graphite and Cu spreaders on display / rear cover Hotter Cooler LCD BackLite CPU Larger heat spreaders for main hot component Dont stack CPU underneath the display backlight LCD Make batteries split. (Optimum)

CPU Increased Cu content in the motherboard Rear Cover Separate heat source can make LCD cooler Thermal Consideration Thermal ideas for thin form factors Enough air gap Select Low-power panel Graphite and Cu spreaders on display / rear cover Larger heat spreaders for main hot component Dont stack CPU underneath the display backlight

High Touch Battery Low Touch High Touch Battery Make batteries split. (Optimum) Increased Cu content in the motherboard Put cooler component underneath high-touch area will improve UX Thermal Consideration Thermal ideas for thin form factors Enough air gap Select Low-power panel Graphite and Cu spreaders on display / rear cover

Larger heat spreaders for main hot component Dont stack CPU underneath the display backlight 30% Cu content 67.1C 70% Cu content 61.2C Make batteries split. (Optimum) Increased Cu content in the motherboard It can spread heat from component and lower whole PCB temperature Summary and Call to Action Intel Core M processors provide flexibility to have thin fanless designs TM Designing Great 2 in 1 devices require tradeoffs for materials, thickness and system designs it can be done Ensure that your system design accounts for all tradeoff and do your simulations Add sensors in chassis to use Tskin for thermal management, not just Tjunction Ensure your platform supports hooks for Continuum Support and adopts Intel DPTF for best thermal optimization

32 Intel Confidential Do Not Forward

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